This is unlikely to become an HB approved setup because of how wiring channels from the piezoes are being fed to the processor in the SI unit ....
The HB SI units have 3 "channels" (wire paths) that connect the processor to the individual piezoes of the stock HDSI xducer..
*2d channel...
*Left SI channel...
*Right SI channel...
The HB dedicated DI units have 2 "channels" (wire paths) that wire the processor to the individual piezoes in the stock dedicated DI xducer...
*2d channel...
*Down channel...
The 2d channel is the same in both xducer's with the same pin configuration....
It just so happens that the wiring configuration of the dedicated DI xducer's "down channel" lines up to the "Right SI channel" of the HB SI unit....(basically the data from the down-pointing DI piezo is being processed thru the right SI channel of the SI unit)...
This leaves the "Left SI channel" of the SI unit with a load on it but nowhere to go...because there is no piezo in the dedicated DI xducer that it's wire lines up with the "left SI channel" of the HB SI unit...
The SI unit processor is still trying to send signals down the "left SI channel"....but there is no piezo in the dedicated DI xducer to receive the signal...
This "left SI channel with a load on it and no piezo to go to"... is not natural for the HB SI unit...no one knows the long term effects of how this may damage (or not damage)....the HB SI unit processor....
(I think HB would probably rather sell extra dedicated DI units anyway as there is more $$ in that option)..
Rickie


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